Очистка температура полупроводник ультразвук очистка машина

Очистка температура полупроводник ультразвук очистка машина

During the cleaning process of silicon wafers, the temperature of the cleaning solution is a key factor. Proper cleaning temperature can accelerate the removal of oil stains and achieve the best cleaning effect. When the silicon wafer is immersed in the cleaning liquid, the oil stain on the silicon wafer expands, and the force inside the oil stain and between the oil stain and the silicon wafer decreases. The higher the temperature, the greater the oil stain expansion, and the weaker the force. The more easily the surfactant molecules pry the oil stain off the surface of the silicon wafer. At the same time, changes in temperature can lead to changes in the properties of the micelles themselves and the dissolution of solubilized substances in the micelles. The polyoxyethylene chain (CH2CH2O) n of a polyoxyethylene type surfactant hydrates in water, forming a hydrogen bond with the hydrogen in the water molecule. As the temperature increases, hydrogen bonds weaken, some even break, and hydration decreases. Micelles are easy to form, and the aggregation number of micelles also significantly increases, increasing the solubilization of pollutants such as grease. This situation is conducive to the cleaning of silicon wafers. When the temperature rises to about 60 degree , the polyoxyethylene chain (CH2CH2O) n accelerates dehydration and produces curling, reducing the solubilization space of the micelles, reducing the compatibilization ability, and changing the cleaning solution from transparent to emulsion. This temperature is called the cloud point temperature of the solution. The solubilization ability is strongest only when the temperature is close to the cloud point temperature of the surfactant solution, so it is reasonable to set the temperature of the cleaning solution at 60 degree .

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